Hardware & embedded engineering

The hardware and the software that runs on it, under one roof.

An engineering company that takes a connected product from concept to a tested, manufacturable board — the hardware and the software that runs on it, under one roof.

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What we do here

Choosing the part your product can actually ship on, at the volume and price you are aiming for.

  • Rockchip RK3566
  • NXP i.MX6
  • Jetson Orin Nano
  • Zynq UltraScale+ MPSoC

Arrow keys or click to move through the stack

Track record

Projects delivered
180+
Years
6
Delivered on time
97%
Delivered on budget
96%
PCB layout
Up to 16 layers
Prototype fabrication
In-house CNC

Clients in Canada, New Zealand, Norway, Poland and Spain.

The problem we remove

A founder building hardware normally has to hire a PCB shop and a firmware contractor separately, then personally manage the seam between them.

That seam is where hardware projects fail, and it’s where two vendors point at each other. We removed it by keeping both halves on the same team.

What we do

Five things, done properly

All capabilities →

Hardware engineering

The physical board, from first schematic to a populated unit on the bench.

  • Schematic capture
  • Multi-layer PCB layout to 16 layers
  • Power electronics
  • Analog and digital circuit design
  • FPGA (Verilog/VHDL)
  • Enclosure and 3D design
  • In-house CNC prototype fabrication
  • Assembly, bring-up and test

Embedded Linux

Making Linux run properly on hardware that did not exist last month.

  • Board support package development
  • Kernel and driver work
  • Yocto/OpenEmbedded and PetaLinux
  • U-Boot, device trees and overlays
  • Boot-time reduction
  • Secure and encrypted boot, disk encryption
  • Audio pipelines (ALSA SoC, PulseAudio, PipeWire)
  • Camera and vision (V4L2, MIPI-CSI, GStreamer)

Firmware

Code close enough to the metal that every abstraction has to earn its place.

  • Bare-metal and RTOS
  • Microcontroller development (STM32, ESP32, ESP32-S3)
  • Real-time C++17
  • Safety-critical development written against MISRA-C/C++, with ISO 26262 and AUTOSAR alignment

Connectivity

Getting constrained devices to talk, reliably, on the radio they can afford.

  • TCP/IP stacks for constrained devices
  • Mesh networking
  • Wi-Fi HaLow (802.11ah)
  • ZigBee (802.15.4)
  • AODV and OLSR routing
  • Cellular module integration
  • OpenWRT

Production and manufacturing support

The unglamorous half that decides whether unit 500 works as well as unit one.

  • Hardware validation suites
  • JTAG debugging and flashing
  • Encrypted flashing pipelines
  • EEPROM and SoC provisioning
  • Boot from SD, NAND and QSPI
  • CI-managed builds (GitLab)
  • DFM and fabrication file preparation

How we engage

  • End-to-end product development
  • Prototype development
  • Prototype plus small-batch production
  • Production handoff
See engagement shapes →

How a project runs

Five stages, and what you hold at the end of each

The only numbered sequence on this site, because it is the only thing here that genuinely happens in order.

  1. 01

    scope

    A written specification, a block diagram and a part shortlist you can take to anyone.

  2. 02

    design

    A reviewable schematic, a bill of materials, and the layout stackup and constraints documented.

  3. 03

    prototype

    A board milled on our own CNC, populated and powered. No fab queue between revisions.

  4. 04

    bring-up

    Bootloader, kernel, drivers and application running, with the bring-up log and measurements.

  5. 05

    handoff

    Fabrication files, a validation suite, provisioning and flashing tooling, and the sources.

Where this gets used

  • Connected devices and IoT

    Sensor nodes, gateways, and cellular or wireless products that have to survive being deployed somewhere inconvenient.

  • Real-time audio and voice

    Multi-microphone boards and low-latency pipelines — both founders have worked on this from opposite ends of the stack.

  • Industrial and power systems

    Inverters, converters, motor drives, power monitoring and PV, with three years of industrial power electronics behind it.

Also:medical and biomedical instrumentationembedded networking and connectivity

Engineering experience

What our engineers have already shipped

All experience →
  • A real-time voice platform, Raspberry Pi to Rockchip

    A voice product built on Raspberry Pi needed to move to Rockchip RK3566 and RK3568 hardware without losing any peripheral support, and it had to wake up fast enough to feel immediate.

    Work by our embedded lead, carried out in a prior senior engineering role rather than for Mycronex Labs. Described here as team experience, not a company project.

  • A TCP/IP stack for constrained IoT devices

    A family of IoT devices needed to talk to each other and to the network across three very different targets — an STM32 microcontroller, a Compute Module 4, and full Linux.

    Work by our embedded lead in a prior R&D role, not a Mycronex Labs engagement. Team experience.

  • A Jetson Orin Nano BSP with a production validation suite

    An NVIDIA Jetson Orin Nano carrier needed a board support package under JetPack 6.2, a set of sensors and interfaces brought up on it, and a repeatable way to flash and verify units.

    Work by our embedded lead under prior employment, not a Mycronex Labs engagement. Team experience.

The lab

In-house CNC prototype fabrication and the bench equipment behind every board we build.

See the facilities

The team

  • Portrait — Saddam Gul

    NO STOCK PHOTOGRAPHY — PLACEHOLDER

    Saddam Gul

    Co-founder — hardware and electronics

    6 years experience

    Saddam leads the hardware side: circuit design, PCB layout, power electronics and prototyping. He has delivered 180+ electronics projects over six years, with a 97% on-time and 96% on-budget record, and lays out boards up to 16 layers. He owns and runs the CNC mill the lab uses for prototype PCB fabrication, and does layout, prototype build, assembly and test in-house — which is what makes a board turnaround measured in days rather than fab-queue weeks possible. He holds an MS in Electrical Engineering (Power) from NUST and a BS in Electronics Engineering from International Islamic University Islamabad, where his final year project took first position at the university's annual open house. He works in Altium Designer, KiCad, EasyEDA, DipTrace and CircuitMaker, and simulates in MATLAB, Simulink, PSIM, Proteus and Multisim. Published: “An ANN Based MPPT Control of Modified Flyback Converter for PV Systems in Active Buildings”, Elsevier, 2024.

  • Portrait — Zawar Khan

    NO STOCK PHOTOGRAPHY — PLACEHOLDER

    Zawar Khan

    Co-founder — embedded Linux, firmware and connectivity

    8 years experience

    Zawar leads the software side: board support packages, kernel and driver work, connectivity and the tooling that gets firmware onto boards in production. Across eight years and six engineering roles he has brought Linux up on five silicon families spanning PowerPC through ARM64 — including Rockchip RK3566 and RK3568, NVIDIA Jetson Orin Nano, Xilinx Zynq UltraScale+ MPSoC, NXP i.MX6 and NXP QorIQ T1042RDB — building custom Yocto and PetaLinux layers, U-Boot configurations, device trees and overlays, and cutting boot times through kernel defconfig tuning and init sequence work. His connectivity work runs from designing a TCP/IP stack for constrained IoT devices across STM32, CM4 and Linux, through mesh networking, Wi-Fi HaLow (802.11ah), ZigBee (802.15.4), AODV and OLSR routing, to cellular module integration and OpenWRT. He also writes safety-critical firmware in C and C++ against MISRA-C/C++, with ISO 26262 and AUTOSAR alignment. He holds two master's degrees — an MSc in Biomedical Engineering from Shanghai Jiao Tong University and an MSc in Electrical & Communications Engineering from UET Peshawar — plus a BSc in Electrical Engineering from UET Peshawar. He is CCNA certified and holds Fortinet NSE1 and NSE2. Published as Z. K. Khattak: first author on a wearable-sensor gait and balance study in The Spine Journal (2023), and on adaptive clustering for energy-efficient routing in wireless sensor networks in the International Journal of Innovations in Science & Technology (2022).

Team composition

[[TODO: team headcount by discipline]]

Notes

[[TODO: three Notes posts]]

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